W25Q32FWTBIQ View Datasheet(PDF) - Winbond
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Description
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W25Q32FWTBIQ Datasheet PDF : 94 Pages
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W25Q32FW
3. PACKAGE TYPES AND PIN CONFIGURATIONS
3.1 Pin Configuration SOIC / VSOP 208-mil
/CS
DO (IO1)
/WP (IO2)
Top View
1
8
2
7
3
6
VCC
/HOLD or /RESET
(IO3)
CLK
GND
4
5
DI (IO0)
Figure 1a. W25Q32FW Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS, ST)
3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm
Top View
/CS
DO (IO1)
/WP (IO2)
18
27
36
VCC
/HOLD or /RESET
(IO3)
CLK
GND
45
DI (IO0)
Figure 1b. W25Q32FW Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm, XSON 4x4-mm (Package Code ZP, ZE, XG)
3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm, XSON 4x4-mm
PIN NO.
PIN NAME
I/O
FUNCTION
1
/CS
I
Chip Select Input
2
DO (IO1)
I/O
Data Output (Data Input Output 1)(1)
3
/WP (IO2)
I/O
Write Protect Input ( Data Input Output 2)(2)
4
GND
Ground
5
DI (IO0)
I/O
Data Input (Data Input Output 0)(1)
6
CLK
I
Serial Clock Input
7
/HOLD or /RESET
(IO3)
I/O
Hold or Reset Input (Data Input Output 3)(2)
8
VCC
Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
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