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W25Q32FWTBIQ View Datasheet(PDF) - Winbond

Part NameDescriptionManufacturer
W25Q32FWTBIQ 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Winbond
Winbond Winbond
W25Q32FWTBIQ Datasheet PDF : 94 Pages
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W25Q32FW
1. GENERAL DESCRIPTIONS
The W25Q32FW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption
as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages.
The W25Q32FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FW has
1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater
flexibility in applications that require data and parameter storage. (See Figure 2.)
The W25Q32FW support the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI as well as 2-
clocks instruction cycle Quad Peripheral Interface (QPI): Serial Clock, Chip Select, Serial Data I/O0 (DI),
I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing
equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when
using the Fast Read Dual/Quad I/O and QPI instructions. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP
(execute in place) operation.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control, provide
further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device ID, a
64-bit Unique Serial Number and three 256-bytes Security Registers.
2. FEATURES
New Family of SpiFlash Memories
W25Q32FW: 32M-bit / 4M-byte
Standard SPI: CLK, /CS, DI, DO, /WP,
/Hold
Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
QPI: CLK, /CS, IO0, IO1, IO2, IO3
Software & Hardware Reset
Highest Performance Serial Flash
104MHz Single, Dual/Quad SPI clocks
208/416MHz equivalent Dual/Quad SPI
50MB/S continuous data transfer rate
Min 100K Program-Erase cycles per sector
More than 20-year data retention
Efficient “Continuous Read” and QPI
Mode
Continuous Read with 8/16/32/64-Byte
Wrap
As few as 8 clocks to address memory
Quad Peripheral Interface (QPI) reduces
instruction overhead
Allows true XIP (execute in place)
operation
Outperforms X16 Parallel Flash
Flexible Architecture with 4KB sectors
Uniform Sector/Block Erase (4K/32K/64K-Byte)
Program 1 to 256 byte per programmable page
Erase/Program Suspend & Resume
Advanced Security Features
Software and Hardware Write-Protect
Power Supply Lock-Down and OTP protection
Top/Bottom, Complement array protection
Individual Block/Sector array protection
64-Bit Unique ID for each device
Discoverable Parameters (SFDP) Register
3X256-Bytes Security Registers with OTP
locks
Volatile & Non-volatile Status Register Bits
Space Efficient Packaging
8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
8-pad WSON 6x5-mm / 8x6-mm
16-pin SOIC 300-mil (additional /RESET)
24-ball TFBGA 8x6-mm(additional /RESET)
12-ball WLCSP
Contact Winbond for KGD and other options
Publication Release Date: July 01, 2016
-4-
- Revision H
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