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W25Q32FWTBIQ View Datasheet(PDF) - Winbond

Part NameW25Q32FWTBIQ Winbond
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W25Q32FWTBIQ Datasheet PDF : 94 Pages
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8.2.19 Erase / Program Suspend (75h)
The Erase/Program Suspend instruction “75h”, allows the system to interrupt a Sector or Block Erase
operation or a Page Program operation and then read from or program/erase data to, any other sectors or
blocks. The Erase/Program Suspend instruction sequence is shown in Figure 35a & 35b.
The Write Status Register instruction (01h) and Erase instructions (20h, 52h, D8h, C7h, 60h, 44h) are not
allowed during Erase Suspend. Erase Suspend is valid only during the Sector or Block erase operation. If
written during the Chip Erase operation, the Erase Suspend instruction is ignored. The Write Status
Register instruction (01h) and Program instructions (02h, 32h, 42h) are not allowed during Program
Suspend. Program Suspend is valid only during the Page Program or Quad Page Program operation.
The Erase/Program Suspend instruction “75h” will be accepted by the device only if the SUS bit in the
Status Register equals to 0 and the BUSY bit equals to 1 while a Sector or Block Erase or a Page Program
operation is on-going. If the SUS bit equals to 1 or the BUSY bit equals to 0, the Suspend instruction will
be ignored by the device. A maximum of time of “tSUS” (See AC Characteristics) is required to suspend the
erase or program operation. The BUSY bit in the Status Register will be cleared from 1 to 0 within “tSUS
and the SUS bit in the Status Register will be set from 0 to 1 immediately after Erase/Program Suspend.
For a previously resumed Erase/Program operation, it is also required that the Suspend instruction “75h” is
not issued earlier than a minimum of time of “tSUS” following the preceding Resume instruction “7Ah”.
Unexpected power off during the Erase/Program suspend state will reset the device and release the
suspend state. SUS bit in the Status Register will also reset to 0. The data within the page, sector or block
that was being suspended may become corrupted. It is recommended for the user to implement system
design techniques against the accidental power interruption and preserve data integrity during
erase/program suspend state.
Mode 3
Mode 0
Instruction (75h)
High Impedance
Mode 3
Mode 0
Accept instructions
Figure 35a. Erase/Program Suspend Instruction (SPI Mode)
- 50 -
Publication Release Date: July 01, 2016
- Revision H
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The W25Q32FW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages.
The W25Q32FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FW has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)

● New Family of SpiFlash Memories
   – W25Q32FW: 32M-bit / 4M-byte
   – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – QPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Software & Hardware Reset
● Highest Performance Serial Flash
   – 104MHz Single, Dual/Quad SPI clocks
   – 208/416MHz equivalent Dual/Quad SPI
   – 50MB/S continuous data transfer rate
   – Min 100K Program-Erase cycles per secto
   – More than 20-year data retention
● Efficient “Continuous Read” and QPI Mode
   – Continuous Read with 8/16/32/64-Byte Wrap
   – As few as 8 clocks to address memory
   – Quad Peripheral Interface (QPI) reduces instruction overhead
   – Allows true XIP (execute in place) operation
   – Outperforms X16 Parallel Flash
● Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
● Advanced Security Features
   – Software and Hardware Write-Protect
   – Power Supply Lock-Down and OTP protection
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers with OTP locks
   – Volatile & Non-volatile Status Register Bits
● Space Efficient Packaging
   – 8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
   – 8-pad WSON 6x5-mm / 8x6-mm
   – 16-pin SOIC 300-mil (additional /RESET)
   – 24-ball TFBGA 8x6-mm(additional /RESET)
   – 12-ball WLCSP
   – Contact Winbond for KGD and other options

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