datasheetbank_Logo    Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site
Part Name :

W25Q32FWTBIQ View Datasheet(PDF) - Winbond

Part NameW25Q32FWTBIQ Winbond
Winbond Winbond
Description1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32FWTBIQ Datasheet PDF : 94 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
W25Q32FW
8.2.29 Erase Security Registers (44h) ...........................................................................................62
8.2.30 Program Security Registers (42h).......................................................................................63
8.2.31 Read Security Registers (48h)............................................................................................64
8.2.32 Set Read Parameters (C0h) ...............................................................................................65
8.2.33 Burst Read with Wrap (0Ch) ...............................................................................................66
8.2.34 Enter QPI Mode (38h).........................................................................................................67
8.2.35 Exit QPI Mode (FFh) ...........................................................................................................68
8.2.36 Individual Block/Sector Lock (36h)......................................................................................69
8.2.37 Individual Block/Sector Unlock (39h) ..................................................................................70
8.2.38 Read Block/Sector Lock (3Dh)............................................................................................71
8.2.39 Global Block/Sector Lock (7Eh) ..........................................................................................72
8.2.40 Global Block/Sector Unlock (98h) .......................................................................................72
8.2.41 Enable Reset (66h) and Reset Device (99h) ......................................................................73
9. ELECTRICAL CHARACTERISTICS............................................................................................... 74
9.1 Absolute Maximum Ratings (1) .......................................................................................... 74
9.2 Operating Ranges .............................................................................................................. 74
9.3 Power-up Power-down Timing and Requirements............................................................. 75
9.4 DC Electrical Characteristics .............................................................................................. 76
9.5 AC Measurement Conditions ............................................................................................. 77
9.6 AC Electrical Characteristics(6) ........................................................................................... 78
9.7 Serial Output Timing........................................................................................................... 80
9.8 Serial Input Timing.............................................................................................................. 80
9.9 /HOLD Timing..................................................................................................................... 80
9.10 /WP Timing ......................................................................................................................... 80
10. PACKAGE SPECIFICATIONS ....................................................................................................... 81
10.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 81
10.2 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 82
10.3 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 83
10.4 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 84
10.5 Pad XSON 4x4x0.45-mm (Package Code XG).................................................................. 85
10.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 86
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 87
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 88
10.9 12-Ball WLCSP (Package Code BYIC) .............................................................................. 89
10.10 12-Ball WLCSP (Package Code BYIG) ............................................................................ 90
10.11 Ordering Information ......................................................................................................... 91
10.12 Valid Part Numbers and Top Side Marking ...................................................................... 92
11. REVISION HISTORY...................................................................................................................... 93
-3-
Direct download click here

GENERAL DESCRIPTIONS
The W25Q32FW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages.
The W25Q32FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FW has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)

FEATURES
● New Family of SpiFlash Memories
   – W25Q32FW: 32M-bit / 4M-byte
   – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – QPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Software & Hardware Reset
● Highest Performance Serial Flash
   – 104MHz Single, Dual/Quad SPI clocks
   – 208/416MHz equivalent Dual/Quad SPI
   – 50MB/S continuous data transfer rate
   – Min 100K Program-Erase cycles per secto
   – More than 20-year data retention
● Efficient “Continuous Read” and QPI Mode
   – Continuous Read with 8/16/32/64-Byte Wrap
   – As few as 8 clocks to address memory
   – Quad Peripheral Interface (QPI) reduces instruction overhead
   – Allows true XIP (execute in place) operation
   – Outperforms X16 Parallel Flash
● Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
● Advanced Security Features
   – Software and Hardware Write-Protect
   – Power Supply Lock-Down and OTP protection
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers with OTP locks
   – Volatile & Non-volatile Status Register Bits
● Space Efficient Packaging
   – 8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
   – 8-pad WSON 6x5-mm / 8x6-mm
   – 16-pin SOIC 300-mil (additional /RESET)
   – 24-ball TFBGA 8x6-mm(additional /RESET)
   – 12-ball WLCSP
   – Contact Winbond for KGD and other options

Share Link : Winbond
@ 2014 - 2018  [ Home ] [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]