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W25Q32FWTBIQ View Datasheet(PDF) - Winbond

Part NameDescriptionManufacturer
W25Q32FWTBIQ 1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Winbond
Winbond Winbond
W25Q32FWTBIQ Datasheet PDF : 94 Pages
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W25Q32FW
8.2.29 Erase Security Registers (44h) ...........................................................................................62
8.2.30 Program Security Registers (42h).......................................................................................63
8.2.31 Read Security Registers (48h)............................................................................................64
8.2.32 Set Read Parameters (C0h) ...............................................................................................65
8.2.33 Burst Read with Wrap (0Ch) ...............................................................................................66
8.2.34 Enter QPI Mode (38h).........................................................................................................67
8.2.35 Exit QPI Mode (FFh) ...........................................................................................................68
8.2.36 Individual Block/Sector Lock (36h)......................................................................................69
8.2.37 Individual Block/Sector Unlock (39h) ..................................................................................70
8.2.38 Read Block/Sector Lock (3Dh)............................................................................................71
8.2.39 Global Block/Sector Lock (7Eh) ..........................................................................................72
8.2.40 Global Block/Sector Unlock (98h) .......................................................................................72
8.2.41 Enable Reset (66h) and Reset Device (99h) ......................................................................73
9. ELECTRICAL CHARACTERISTICS............................................................................................... 74
9.1 Absolute Maximum Ratings (1) .......................................................................................... 74
9.2 Operating Ranges .............................................................................................................. 74
9.3 Power-up Power-down Timing and Requirements............................................................. 75
9.4 DC Electrical Characteristics .............................................................................................. 76
9.5 AC Measurement Conditions ............................................................................................. 77
9.6 AC Electrical Characteristics(6) ........................................................................................... 78
9.7 Serial Output Timing........................................................................................................... 80
9.8 Serial Input Timing.............................................................................................................. 80
9.9 /HOLD Timing..................................................................................................................... 80
9.10 /WP Timing ......................................................................................................................... 80
10. PACKAGE SPECIFICATIONS ....................................................................................................... 81
10.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 81
10.2 8-Pin VSOP 208-mil (Package Code ST)........................................................................... 82
10.3 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 83
10.4 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 84
10.5 Pad XSON 4x4x0.45-mm (Package Code XG).................................................................. 85
10.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 86
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array).......................................... 87
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 88
10.9 12-Ball WLCSP (Package Code BYIC) .............................................................................. 89
10.10 12-Ball WLCSP (Package Code BYIG) ............................................................................ 90
10.11 Ordering Information ......................................................................................................... 91
10.12 Valid Part Numbers and Top Side Marking ...................................................................... 92
11. REVISION HISTORY...................................................................................................................... 93
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