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W25Q32FWTBIQ View Datasheet(PDF) - Winbond

Part NameW25Q32FWTBIQ Winbond
Winbond Winbond
Description1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32FWTBIQ Datasheet PDF : 94 Pages
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W25Q32FW
8. INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q32FW consists of 45 basic instructions that are
fully controlled through the SPI bus (see Instruction Set Table1-2). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code.
Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
The QPI instruction set of the W25Q32FW consists of 32 basic instructions that are fully controlled through
the SPI bus (see Instruction Set Table 3). Instructions are initiated with the falling edge of Chip Select (/CS).
The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all four IO pins are
sampled on the rising edge of clock with most significant bit (MSB) first. All QPI instructions, addresses,
data and dummy bytes are using all four IO pins to transfer every byte of data with every two serial clocks
(CLK).
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5 through
57. All read instructions can be completed after any clocked bit. However, all instructions that Write,
Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked)
otherwise the instruction will be ignored. This feature further protects the device from inadvertent writes.
Additionally, while the memory is being programmed or erased, or when the Status Register is being written,
all instructions except for Read Status Register will be ignored until the program or erase cycle has
completed.
8.1 Device ID and Instruction Set Tables
8.1.1 Manufacturer and Device Identification
MANUFACTURER ID
(MF7 - MF0)
Winbond Serial Flash
EFh
Device ID
Instruction
W25Q32FW
(ID7 - ID0)
ABh, 90h, 92h, 94h
15h
(ID15 - ID0)
9Fh
6016h
- 22 -
Publication Release Date: July 01, 2016
- Revision H
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GENERAL DESCRIPTIONS
The W25Q32FW (32M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 1.65V to 1.95V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space-saving packages.
The W25Q32FW array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32FW has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.)

FEATURES
● New Family of SpiFlash Memories
   – W25Q32FW: 32M-bit / 4M-byte
   – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – QPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Software & Hardware Reset
● Highest Performance Serial Flash
   – 104MHz Single, Dual/Quad SPI clocks
   – 208/416MHz equivalent Dual/Quad SPI
   – 50MB/S continuous data transfer rate
   – Min 100K Program-Erase cycles per secto
   – More than 20-year data retention
● Efficient “Continuous Read” and QPI Mode
   – Continuous Read with 8/16/32/64-Byte Wrap
   – As few as 8 clocks to address memory
   – Quad Peripheral Interface (QPI) reduces instruction overhead
   – Allows true XIP (execute in place) operation
   – Outperforms X16 Parallel Flash
● Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4K/32K/64K-Byte)
   – Program 1 to 256 byte per programmable page
   – Erase/Program Suspend & Resume
● Advanced Security Features
   – Software and Hardware Write-Protect
   – Power Supply Lock-Down and OTP protection
   – Top/Bottom, Complement array protection
   – Individual Block/Sector array protection
   – 64-Bit Unique ID for each device
   – Discoverable Parameters (SFDP) Register
   – 3X256-Bytes Security Registers with OTP locks
   – Volatile & Non-volatile Status Register Bits
● Space Efficient Packaging
   – 8-pin SOIC/VSOP 208-mil, XSON 4x4-mm
   – 8-pad WSON 6x5-mm / 8x6-mm
   – 16-pin SOIC 300-mil (additional /RESET)
   – 24-ball TFBGA 8x6-mm(additional /RESET)
   – 12-ball WLCSP
   – Contact Winbond for KGD and other options

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