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TS27M4ACDT View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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TS27M4ACDT Datasheet PDF : 14 Pages
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TS27M4C, TS27M4I, TS27M4M
4
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
4.1
DIP14 package information
Figure 15. DIP14 package mechanical drawing
Table 4.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
DIP14 package mechanical data
Millimeters
Min.
Typ.
Max.
0.51
1.39
1.65
0.5
0.25
20
8.5
2.54
15.24
7.1
5.1
3.3
1.27
2.54
Min.
0.020
0.055
0.050
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
0.130
Max.
0.065
0.787
0.280
0.201
0.100
9/14
 

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