MC33880DWR2 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

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MC33880DWR2

Configurable Octal Serial Switch with Serial Peripheral Interface I/O

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

VDD Supply Voltage (1)

VDD

-0.3 to 7.0

VDC

CS, DI, DO, SCLK, IN5, IN6, and EN (1)

–

-0.3 to 7.0

VDC

VPWR Supply Voltage (1)

VPWR

-16 to 50

VDC

Drain 1 – 8 (2)

5.0 mA ≤ IOUT ≤ 0.3 A

–

VDC

-18 to 40

Source 1 – 8 (3)

5.0 mA ≤ IOUT ≤ 0.3 A

–

VDC

-28 to 40

Output Voltage Clamp Low-Side Drive (4)

VOC

40 to 55

VDC

Output Voltage Clamp High-Side Drive (4)

VOC

-15 to -25

VDC

Output Clamp Energy (5)

ECLAMP

50

mJ

ESD Voltage (6)

Human Body Model

Machine Model

Storage Temperature

Operating Case Temperature

Operating Junction Temperature

Maximum Junction Temperature

V

VESD1

VESD2

±2000

±200

TSTG

-55 to 150

°C

TC

-40 to 125

°C

TJ

-40 to 150

°C

–

-40 to 150

°C

Power Dissipation (TA = 25°C) (7)

28 SOIC, Case 751F-05

32 SOIC, Case 1324-02

PD

W

1.3

1.7

Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05

Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02

Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02

Peak Package Reflow Temperature During Reflow (8), (9)

RθJA

RθJA

RθJL

TPPRT

94

70

18

Note 9

°C/W

°C/W

°C

Notes

1. Exceeding these limits may cause malfunction or permanent damage to the device.

2. Configured as low-side driver with 300 mA load as current limit.

3. Configured as high-side driver with 300 mA load as current limit.

4. With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.

5. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.

6. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), and ESD2 testing is performed

in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

7. Maximum power dissipation with no heatsink used.

8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

33880

5

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