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TS68C429AMR View Datasheet(PDF) - Unspecified

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TS68C429AMR Datasheet PDF : 46 Pages
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TS68C429A
5.3.1
Figure 5-1. Clock Input Timing Diagram
tcyc
tCL
tCH
2.25V
0.8V
tCR
tCF
Note:
Timing measurements are referenced to and from a low of 0.8-volt and a high voltage of 2.25 volts, unless
otherwise noted. The voltage swing through this range should start outside and pass through the range
such that the rise or fall will be linear between
0.8-volt and 2.25 volts.
Table 5-3. Thermal Characteristics
Package
Symbol
Parameter
PGA 68
CQFP 132
θJ-A
Thermal Resistance Junction-to-ambient
θJ-C
Thermal Resistance Junction-to-case
θJ-A
Thermal Resistance Junction-to-ambient
θJ-C
Thermal Resistance Junction-to-case
Value
28
2
27
3
Unit
°C/W
°C/W
°C/W
°C/W
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from:
TJ = TA + (PD ⋅ θJA)
(1)
TA = Ambient Temperature, °C
θJA = Package Thermal Resistance, Junction-to-Ambient, °C/W
PD = PINT + PI/O
PINT = ICC x VCC, Watts–Chip Internal Power
PI/O = Power Dissipation on Input and Output Pins–User Determined
For most applications PI/O < PINT and can be neglected.
An approximate relationship between PD and TJ (if PI/O is neglected) is:
PD = K: (TJ + 273)
(2)
Solving equations (1) and (2) for K gives:
K = PD (TA + 273) + θJA PD2
(3)
where K is a constant pertaining to the particular part K can be determined from equation (3) by measur-
ing PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations (1) and (2) iteratively for any value of TA.
The total thermal resistance of a package (θJA) can be separated into two components, θJC and θCA, rep-
resenting the barrier to heat flow from the semiconductor junction to the package (case), surface (θJC)
and from the case to the outside ambient (θCA).
e2v semiconductors SAS 2008
9
0848E–HIREL–02/08
 

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