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TS68C429AMRA View Datasheet(PDF) - Unspecified

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TS68C429A
These terms are related by the equation:
θJA = θJC + θCA
(4)
θJC is device related and cannot be influenced by the user. However, θCA is user dependent and can be
minimized by such thermal management techniques as heat sinks, ambient air cooling and thermal con-
vection. Thus, good thermal management on the part of the user can significantly reduce θCA so that θJA
approximately equals θJC. Substitution of θJC for θJA in equation (1) will result in a lower semiconductor
junction temperature.
5.4 Mechanical and Environment
The microcircuits shall meet all mechanical environmental requirements of either MIL-STD-883 for class
B devices or DESC devices.
5.5 Marking
The document where are defined the marking are identified in the related reference documents. Each
microcircuit are legibly and permanently marked with the following information as minimum:
• e2v logo
• Manufacturer’s part number
• Class B identification
• Date-code of inspection lot
• ESD identifier if available
• Country of manufacturing
6. Quality Conformance Inspection
6.1 DESC/MIL-STD-883
Is in accordance with MIL-M-38510 and method 5005 of MIL-STD-883. Group A and B inspections are
performed on each production lot. Group C and D inspections are performed on a periodic basis.
7. Electrical Characteristics
7.1 General Requirements
All static and dynamic electrical characteristics specified for inspection purposes and the relevant mea-
surement conditions are given below:
Table 7-1, Table 7-2: Static electrical characteristics for the electrical variants.
Table 7-3, Table 7-4, Table 7-5: Dynamic electrical characteristics.
For static characteristics (Table 7-1, Table 7-2), test methods refer to IEC 748-2 method number, where
existing.
For dynamic characteristics (Table 7-3, Table 7-4, Table 7-5), test methods refer to clause 5.5 of this
specification.
10
0848E–HIREL–02/08
e2v semiconductors SAS 2008
 

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