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MB05F View Datasheet(PDF) - Shenzhen Ping Sheng Electronics Co., Ltd.

Part Name
Description
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MB05F Datasheet PDF : 2 Pages
1 2
Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier
MB05F thru MB10F VOLTAGE - 50 TO 1000 VOLTS CURRENT - 0.5 AMPERES
μ
FEATURES
Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering
260/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
MBF
MECHANICAL DATA
Case: MBF Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
(TA = 25 °C unless otherwise noted)
Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT
Maximum repetitive peak reverse voltage
VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage
VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage
VDC 50 100 200 400 600 800 1000 V
Maximum average forward output rectified
current at TA=30-on glass-epoxy P.C.B(NOTE 1) IF(AV)
0.5
A
-on aluminum substrate(NOTE 2)
0.8
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
IFSM
35
A
Maximum instantaneous forwad voltage drop
per leg at 0.4A
VF
Maximum DC reverse current at TA = 25
rated DC blocking voltage per leg TA = 125
IR
1
V
5.0
100
μA
Typical junction capacitance per leg at 4.0 V ,1MHz
CJ
13
pF
(NOTE 1) RθJA
85
Thermal resistance per leg
(NOTE 2) RθJA
70
(NOTE 1) RθJL
20
Operating junction and storage temperature range
TJ, TSTG
55 to +150
NOTE1:On glass epoxy P.C.B. mounted on 0.05×0.05(1.3×1.3mm) pads
NOTE2:On aluminum substrate P.C.B. with an area of 0.8″×0.8(20×20mm) mounted
on 0.05×0.05(1.3×1.3mm) solder pad
/ W
Web Site: WWW.PS-PFS.COM
 

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