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TS12001 View Datasheet(PDF) - Semtech Corporation

Part Name
Description
View to exact match
TS12001 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
Pin Description
Pin # Pin Name
Pin Type (1)
1
GND
P
2
VOUT
O
3
NC
4
NC
5
NC
6
VCC
I/P
7
VCC
I/P
8
nPG
O
(1) I = Input, O = Output, P = Power
Description
GND
Output to System Load
No Connect (connect to GND or float)
No Connect (connect to GND or float)
No Connect (connect to GND or float)
Supply Input
Supply Input
Open-Drain N-Channel Output (low indicates Power Good)
Absolute Maximum Ratings
Over operating free–air temperature range unless otherwise noted(2, 3, 4)
Parameter
Value
Unit
VCC, VOUT, nPG
-0.3 to 6.0
V
Electrostatic Discharge – Human Body Model
2
kV
Operating Junction Temperature Range, TJ
Storage Temperature Range, TSTG
Lead Temperature (soldering, 10 seconds)
-20 to 85
°C
-65 to 150
°C
260
°C
(2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating con-
ditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(3) All voltage values are with respect to network ground terminal.
(4) ESD testing is performed according to the respective JESD22 JEDEC standard.
Thermal Characteristics
Package DFN
θJA (°C/W)
(See Note 5)
θJC (°C/W)
(See Note 6)
8 pin
73.1
10.7
(5) This assumes a FR4 board only.
(6) This assumes a 1 Oz. Copper JEDEC standard board with thermal vias – See Exposed Pad section and application note
for more information.
TS12001
Final Datasheet
April 30, 2015
Rev 1.3
www.semtech.com
3 of 11
Semtech
 

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