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CX28HC256KMB-12 View Datasheet(PDF) - Rochester Electronics

Part Name
Description
View to exact match
CX28HC256KMB-12
ROCHESTER
Rochester Electronics ROCHESTER
CX28HC256KMB-12 Datasheet PDF : 21 Pages
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X28HC256
Ordering Information (Continued)
PART NUMBER
ACCESS TIME TEMP. RANGE
PART MARKING
(ns)
(°C)
PACKAGE
PKG. DWG. #
X28HC256PIZ-12 (Note) X28HC256PI-12 RRZ
-40 to +85 28 Ld PDIP (Pb-free)***
E28.6
X28HC256S-12*
X28HC256S-12 RR
120
0 to +70 28 Ld SOIC (300 mils)
MDP0027
X28HC256SZ-12 (Note) X28HC256S-12 RRZ
0 to +70 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SI-12*
X28HC256SI-12 RR
-40 to +85 28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-12 (Note) X28HC256SI-12 RRZ
-40 to +85 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SM-12*, **
X28HC256SM-12 RR
-55 to +125 28 Ld SOIC (300 mils)
MDP0027
X28HC256D-90
X28HC256D-90 RR
90
0 to +70 28 Ld CERDIP (520 mils)
F28.6
X28HC256DI-90
X28HC256DI-90 RR
-40 to +85 28 Ld CERDIP (520 mils)
F28.6
X28HC256DM-90
X28HC256DM-90 RR
-55 to +125 28 Ld CERDIP (520 mils)
F28.6
X28HC256DMB-90
C X28HC256DMB-90
MIL-STD-883 28 Ld CERDIP (520 mils)
F28.6
X28HC256EM-90
X28HC256EM-90 RR
-55 to +125 32 Ld LCC (458 mils)
X28HC256EMB-90
C X28HC256EMB-90
MIL-STD-883 32 Ld LCC (458 mils)
X28HC256FI-90
X28HC256FI-90 RR
-40 to +85 28 Ld FLATPACK (440 mils)
X28HC256FM-90
X28HC256FM-90 RR
-55 to +125 28 Ld FLATPACK (440 mils)
X28HC256FMB-90
C X28HC256FMB-90
MIL-STD-883 28 Ld FLATPACK (440 mils)
X28HC256J-90*
X28HC256J-90 RR
0 to +70 32 Ld PLCC
N32.45x55
X28HC256JZ-90* (Note) X28HC256J-90 ZRR
0 to +70 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JI-90*
X28HC256JI-90 RR
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-90* (Note) X28HC256JI-90 ZRR
-40 to +85 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JM-90*
X28HC256JM-90 RR
-55 to +125 32 Ld PLCC
N32.45x55
X28HC256KM-90
X28HC256KM-90 RR
-55 to +125 28 Ld PGA
G28.550x650A
X28HC256KMB-90
C X28HC256KMB-90
MIL-STD-883 28 Ld PGA
G28.550x650A
X28HC256P-90
X28HC256P-90 RR
90
0 to +70 28 Ld PDIP
E28.6
X28HC256PZ-90 (Note) X28HC256P-90 RRZ
0 to +70 28 Ld PDIP (Pb-free)***
E28.6
X28HC256PI-90
X28HC256PI-90 RR
-40 to +85 28 Ld PDIP
E28.6
X28HC256PIZ-90 (Note) X28HC256PI-90 RRZ
-40 to +85 28 Ld PDIP (Pb-free)**
E28.6
X28HC256S-90*
X28HC256S-90 RR
0 to +70 28 Ld SOIC (300 mils)
MDP0027
X28HC256SI-90*
X28HC256SI-90 RR
-40 to +85 28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-90 (Note) X28HC256SI-90 RRZ
-40 to +85 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SI-20T1
200
-40 to +85 28 Ld SOIC (300 mils) Tape and Reel MDP0027
*Add "T1" suffix for tape and reel.
**Add "T2" suffix for tape and reel.
***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3
FN8108.2
May 7, 2007
 

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