BA00DD0xx series BA00CC0xx series
Board size : 70×70×1.6 ㎜ 3 board contains a thermal
Board front copper foil area : 10.5×10.5 ㎜ 2
2-layer board (back surface copper foil area :15×15 ㎜ 2)
2-layer board (back surface copper foil area :70×70 ㎜ 2)
4-layer board (back surface copper foil area :70×70 ㎜ 2)
1 When using a maximum heat sick : θj-c=6.25(℃/W)
2 When using an IC alone : θj-c=62.5(℃/W)
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.28 through 30.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC at
temperatures less than the maximum junction temperature TjMAX.
Fig.29 shows the acceptable loss and heat reducing characteristics of the TO220FP package The portion shown by the
diagonal line is the acceptable loss range that can be used with the IC alone. Even when the ambient temperature Ta is a
normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please operate the IC at temperatures
less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows:
Pc = (Vcc-Vo)×Io＋Vcc×Icca
Acceptable loss Pd Pc
Solving this for load current Io in order to operate within the acceptable loss,
Pd – Vcc×Icca
Please refer to Fig.8 and 20 for Icca.
It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design.
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