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74LVT374DB View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
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74LVT374DB
NXP
NXP Semiconductors. NXP
74LVT374DB Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
NXP Semiconductors
74LVT374
3.3 V octal D-type flip-flop; 3-state
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
y
Z
20
c
11
E
A
X
HE
vM A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2 0.13
0.1
0.9
0.5
8o
0o
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT339-1
REFERENCES
JEDEC
JEITA
MO-150
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT339-1 (SSOP20)
74LVT374
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 14 September 2011
© NXP B.V. 2011. All rights reserved.
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