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74AHC30BQ-Q100 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
74AHC30BQ-Q100
NXP
NXP Semiconductors. NXP
74AHC30BQ-Q100 Datasheet PDF : 15 Pages
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NXP Semiconductors
74AHC30-Q100; 74AHCT30-Q100
8-input NAND gate
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
HE
vM A
pin 1 index
1
e
7
bp
wM
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2
0.13
0.1
0.72
0.38
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 9. Package outline SOT402-1 (TSSOP14)
74AHC_AHCT30_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 November 2013
© NXP B.V. 2013. All rights reserved.
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