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741X083220JP View Datasheet(PDF) - CTS Corporation

Part Name
Description
View to exact match
741X083220JP
CTS
CTS Corporation CTS
741X083220JP Datasheet PDF : 5 Pages
1 2 3 4 5
Chip Resistor Arrays
Technical Data
Features
Low Cost
Thick Film Technology
High Density Packaging
Leadless Surface Mount Construction
Tape and Reel Packaging
Solder Coated Nickel Barrier Pads
Isolated and Bussed Circuits
Concave and Convex Terminations
RoHS Compliant Version Available
Product Benefits
High Density Packaging
Up to 30% less space per resistor than 0603 chip resistors
Up to 75% less space per resistor than 0805 chip resistors
Placement Efficiency
Networks require fewer placements than discrete components
Larger overall size eases handling compared to discrete components
Low Profile; Can be used in PCMCIA cards
Electrical and Mechanical Specifications
Series
741
742
743
744
745
746
PCB Area (in²)
Per Resistor
Circuit Type
Resistance
Range, Ohms
70°C Power
Per Resistor*
0.0015
0.0037
0.0071
0.0094
0.0058
0.0013
Isolated
Isolated
Isolated
Isolated
Bussed
Bussed
10 - 1M
10 - 1M
10 - 1M
10 - 1M
33 - 470K
33 - 100K
.063W
.063W
.100W
.125W
.063W
.031W
Maximum
Operating
Voltage
25V
50V
100V
200V
50V
25V
*Total Rated Package Power equals total number of resistors times rated Power Per Resistor
Resistance Tolerance
Operating Temperature Range
Temperature Coefficient
Page 1 of 5
Standard: ±5% or .5(whichever is greater)
-55°C to +125°C
Standard: 200PPM/°C
May 2006
CTS Electronic Components
www.ctscorp.com
 

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