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74LCX541WMX View Datasheet(PDF) - Fairchild Semiconductor

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74LCX541WMX Datasheet PDF : 14 Pages
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February 2006
74LCX541
Low Voltage Octal Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
Features
5V tolerant input and outputs
2.3V–3.6V VCC specifications provided
6.5ns tPD max (VCC = 3.3V), 10µA ICC max
Power-down high impedance inputs and outputs
Supports live insertion/withdrawal1
±24 mA output drive (VCC = 3.0V)
Implements patented noise/ EMI reduction circuitry
Latch-up performance exceeds JEDEC 78 conditions
ESD performance
– Human body model > 2000V
– Machine model > 200V
Leadless Pb-Free DQFN package
General Description
The LCX541 is an octal buffer/line driver designed to be
employed as memory and address drivers, clock drivers
and bus oriented transmitter/receivers. The LCX541 is a
non inverting option of the LCX540.
This device is similar in function to the LCX244 while
providing flow-through architecture (inputs on opposite
side from outputs). This pinout arrangement makes this
device especially useful as an output port for micropro-
cessors, allowing ease of layout and greater PC board
density.
The LCX541 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX541 is fabricated with an advanced CMOS
technology to achieve high speed operation while
maintaining CMOS low power dissipation.
Ordering Information
Order Number
74LCX541WM
74LCX541SJ
74LCX541BQX2
74LCX541MSA
74LCX541MTC
74LCX541MTC_NL3
Package
Number
Package Description
M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC
MO-153, 4.4mm Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDED J-STD-020B.
Notes:
1. To ensure the high impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum
value of the resistor is determined by the current-sourcing capability of the driver.
2. DQFN package available in Tape and Reel only.
3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
©2006 Fairchild Semiconductor Corporation
1
74LCX541 Rev. 2.0.0
www.fairchildsemi.com
 

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