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CXP86217 View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
View to exact match
CXP86217
Sony
Sony Semiconductor Sony
CXP86217 Datasheet PDF : 21 Pages
First Prev 21
Package Outline
Unit: mm
CXP86213/86217, CXP86325/86333, CXP86441/86449/86461
52PIN SDIP (PLASTIC)
+ 0.4
47.0 – 0.1
52
27
0° to 15°
1
26
1.778
0.5 ± 0.1
+ 0.1
0.9 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-52P-01
SDIP052-P-0600
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
COPPER ALLOY
5.6g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 21 –
 

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