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AD1117S View Datasheet(PDF) - Unspecified

Part Name
AD1117S Datasheet PDF : 9 Pages
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To ensure the stability of the AD1117 an output capacitor ofat
least 10F (tantalum)or 50F (aluminum) is required.The value
may change based on the applicationrequirements on the
output load or temperature range. Thecapacitor equivalent
series resistance (ESR) will effect theAD1117 stability. The
value of ESR can vary from the typeof capacitor used in the
applications. The recommendedvalue for ESR is 0.5. The
output capacitance couldincrease in size to above the
minimum value. The largervalue of output capacitance as
high as 100F can improvethe load transient response.
SOLDERING METHODSThe AD1117 SOT-223 package is
designed to be compatiblewith infrared reflow or vapor-phase
reflow solderingtechniques. During soldering the non-active
or mildlyactive fluxes may be used. The AD1117 die is
attached tothe heatsink lead which exits opposite the input,
output, andground pins.Hand soldering and wave soldering
should be avoided sincethese methods can cause damage to the
device withexcessive thermal gradients on the package. The
SOT-223recommended soldering method are as follows: vapor
phasereflow and infrared reflow with the component preheated
towithin 65C of the soldering temperature range.
THERMAL CHARACTERISTICSThe thermal resistance of
AD1117 is 15C/W from junctionto tab and 31 C/W from tab to
ambient for a total of 46C/W from junction to ambient. The
AD1117 features theinternal thermal limiting to protect the
device duringoverload conditions. Special care needs to be taken
duringcontinuos load conditions the maximum
junctiontemperature does not exceed 125 C.Taking the FR-4
printed circuit board and 1/16 thick with 1ounce copper foil as an
experiment (fig.1 & fig.2), the PCBmaterial is effective at
transmitting heat with the tabattached to the pad area and a
ground plane layer on thebackside of the substrate. Refer to table
1 for the results ofthe experiment.The thermal interaction from
other components in theapplication can effect the thermal
resistance of the AD1117.The actual thermal resistance can be
determined withexperimentation. AD1117 power dissipation is
calculated asfollows:
Maximum Junction Temperature range: TJ = Tambient
(max) + PD* thermal resistance (Junction-to-ambient
Maximum Junction temperature must not exceed the

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