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MJ2955 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
MJ2955
ST-Microelectronics
STMicroelectronics ST-Microelectronics
MJ2955 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Package mechanical data
3 Package mechanical data
2N3055 MJ2955
In order to meet environmental requirements, ST offers these devices in ECOPACKĀ®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
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