M38500E1H-XXXSS View Datasheet(PDF) - Renesas Electronics

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M38500E1H-XXXSS

8-BIT CISC SINGLE-CHIP MICROCOMPUTER

Renesas Electronics 

List of figures

Fig. 2.10.4 Reset input time ..................................................................................................... 2-101

Fig. 2.11.1 Memory map of flash memory version for 3850 Group ................................... 2-103

Fig. 2.11.2 Memory map of registers relevant to flash memory ......................................... 2-104

Fig. 2.11.3 Structure of Flash memory control register ........................................................ 2-104

Fig. 2.11.4 Rewrite example of built-in flash memory in serial I/O mode ......................... 2-108

Fig. 2.11.5 Connection example in serial I/O mode (1) ....................................................... 2-109

Fig. 2.11.6 Connection example in serial I/O mode (2) ....................................................... 2-109

Fig. 2.11.7 Connection example in serial I/O mode (3) ....................................................... 2-110

Fig. 2.11.8 Example of rewrite system for built-in flash memory in CPU rewrite mode . 2-111

Fig. 2.11.9 CPU rewrite mode beginning/release flowchart ................................................. 2-112

CHAPTER 3 APPENDIX

Fig. 3.1.1 Circuit for measuring output switching characteristics ............................................ 3-9

Fig. 3.1.2 Timing diagram ........................................................................................................... 3-10

Fig. 3.2.1 Flash memory version power source current standard characteristics (in high-speed

mode, f(XIN) = 8 MHz) ............................................................................................... 3-11

Fig. 3.2.2 Flash memory version power source current standard characteristics (in high-speed

mode, f(XIN) = 4 MHz) ............................................................................................... 3-11

Fig. 3.2.3 Flash memory version power source current standard characteristics (in middle-

speed mode, f(XIN) = 8 MHz) ................................................................................... 3-12

Fig. 3.2.4 Flash memory version power source current standard characteristics (in middle-

speed mode, f(XIN) = 4 MHz) ................................................................................... 3-12

Fig. 3.2.5 Flash memory version power source current standard characteristics (in low-speed

mode) ........................................................................................................................... 3-13

Fig. 3.2.6 Mask ROM version power source current standard characteristics (in high-speed

mode, f(XIN) = 8 MHz) ............................................................................................... 3-14

Fig. 3.2.7 Mask ROM version power source current standard characteristics (in high-speed

mode, f(XIN) = 4 MHz) ............................................................................................... 3-14

Fig. 3.2.8 Mask ROM version power source current standard characteristics (in middle-speed

mode, f(XIN) = 8 MHz) ............................................................................................... 3-15

Fig. 3.2.9 Mask ROM version power source current standard characteristics (in middle-speed

mode, f(XIN) = 4 MHz) ............................................................................................... 3-15

Fig. 3.2.10 Mask ROM version power source current standard characteristics (in low-speed

mode) ......................................................................................................................... 3-16

Fig. 3.2.11 PROM version power source current standard characteristics (in high-speed mode,

f(XIN) = 8 MHz) ......................................................................................................... 3-17

Fig. 3.2.12 PROM version power source current standard characteristics (in high-speed mode,

f(XIN) = 4 MHz) ......................................................................................................... 3-17

Fig. 3.2.13 PROM version power source current standard characteristics (in middle-speed

mode, f(XIN) = 8 MHz) ............................................................................................. 3-18

Fig. 3.2.14 PROM version power source current standard characteristics (in middle-speed

mode, f(XIN) = 4 MHz) ............................................................................................. 3-18

Fig. 3.2.15 PROM version power source current standard characteristics (in low-speed mode)

........................................................................................................................................................ 3-19

Fig. 3.2.16 CMOS output port P-channel side characteristics (Ta = 25 °C) ....................... 3-20

Fig. 3.2.17 CMOS output port N-channel side characteristics (Ta = 25 °C) ...................... 3-20

Fig. 3.2.18 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C) .. 3-21

Fig. 3.2.19 CMOS large current output port N-channel side characteristics (Ta = 25 °C) . 3-21

Fig. 3.2.20 CMOS output port P-channel side characteristics (Ta = 25 °C) ....................... 3-22

Fig. 3.2.21 CMOS output port N-channel side characteristics (Ta = 25 °C) ...................... 3-22

Fig. 3.2.22 N-channel open-drain output port N-channel side characteristics (Ta = 25 °C) .. 3-23

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3850 Group (Spec. H) User’s Manual

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