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CXP86560 View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
MFG CO.
CXP86560
Sony
Sony Semiconductor Sony
CXP86560 Datasheet PDF : 24 Pages
CXP86540/86548/86560
64PIN LQFP (PLASTIC)
12.0 ± 0.2
10.0 ± 0.1
48
33
49
32
64
1
0.5 ± 0.08
16
+ 0.08
0.18 – 0.03
17
(0.22)
A
+ 0.2
1.5 – 0.1
0.1 ± 0.1
+ 0.05
0.127 – 0.02
0.1
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
LQFP-64P-L01
LQFP064-P-1010
NOTE: Dimension “” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE MASS
0.3g
– 24 –
 

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