CXP86560 View Datasheet(PDF) - Sony Semiconductor
Part Name
Description
View to exact match
CXP86560 Datasheet PDF : 24 Pages
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Package Outline
Unit: mm
64PIN SDIP (PLASTIC) 750mil
+ 0.4
57.6 – 0.1
64
33
1
32
1.778
CXP86540/86548/86560
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
SDIP064-P-0750-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY / PHENOL RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
SOLDER PLATING
42 ALLOY
8.6g
51
52
64PIN QFP(PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
33
32
+ 0.1
0.15 – 0.05
0.15
64
1
1.0
20
19
+ 0.15
0.4 – 0.1
+ 0.35
2.75 – 0.15
± 0.12 M
+ 0.2
0.1 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
QFP–64P–L01
∗ QFP064–P–1420
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
COPPER /42 ALLOY
PACKAGE WEIGHT
1.5g
– 23 –
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