ML144110 View Datasheet(PDF) - LANSDALE Semiconductor Inc.
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ML144110 Datasheet PDF : 8 Pages
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ML144110, ML144111
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
P DIP 18 = VP
(ML144110VP)
PLASTIC DIP
CASE 707–02
18
1
A
F
D
HG
10
B
9
C
NK
SEATING
PLANE
L
M
J
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 22.22 23.24 0.875 0.915
B 6.10 6.60 0.240 0.260
C 3.56 4.57 0.140 0.180
D 0.36 0.56 0.014 0.022
F 1.27 1.78 0.050 0.070
G
2.54 BSC
0.100 BSC
H 1.02 1.52 0.040 0.060
J 0.20 0.30 0.008 0.012
K 2.92 3.43 0.115 0.135
L
7.62 BSC
0.300 BSC
M 0° 15° 0° 15°
N 0.51 1.02 0.020 0.040
–A–
20
11
SO 20W = -6P
(ML144110-6P)
SOG PACKAGE
CASE 751D–04
–B– 10X P
0.010 (0.25) M B M
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D
J
0.010 (0.25) M T A S B S
F
18X G
C
–T–
SEATING
PLANE
M
K
R X 45
MILLIMETERS
DIM MIN MAX
A 12.65 12.95
B 7.40 7.60
C 2.35 2.65
D 0.35 0.49
F 0.50 0.90
G
1.27 BSC
J 0.25 0.32
K 0.10 0.25
M
0
7
P 10.05 10.55
R 0.25 0.75
INCHES
MIN MAX
0.499 0.510
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.050 BSC
0.010 0.012
0.004 0.009
0
7
0.395 0.415
0.010 0.029
Page 7 of 8
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