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H02N60E Просмотр технического описания (PDF) - Hi-Sincerity Microelectronics

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H02N60E N-Channel Power Field Effect Transistor Hi-Sincerity
Hi-Sincerity Microelectronics Hi-Sincerity
H02N60E Datasheet PDF : 6 Pages
1 2 3 4 5 6
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : MOS200403
Issued Date : 2004.07.01
Revised Date : 2005.07.14
Page No. : 3/6
TO-252 Dimension
M
Marking:
A
a1
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None H
J
F
0 2N6 0
1
a5
L
C
G
2
3
a2
H
a1
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
N
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM Min. Max.
A
6.35 6.80
C
4.80 5.50
F
1.30 1.70
G
5.40 6.25
H
2.20 3.00
L
0.40 0.90
M
2.20 2.40
N
0.90 1.50
a1 0.40 0.65
a2
-
*2.30
a5 0.65 1.05
*: Typical, Unit: mm
A
B
C
D
a1
E
J
K
a2
y2
F
y1
M
a1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
J
0 2N6 0
GI
y1
H
L
a2
y1
N
a1
O
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Gate 2.Drain 3.Source
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM Min. Max.
A
6.40 6.80
B
-
6.00
C
5.04 5.64
D
-
*4.34
E
0.40 0.80
F
0.50 0.90
G
5.90 6.30
H
2.50 2.90
I
9.20 9.80
J
0.60 1.00
K
-
0.96
L
0.66 0.86
M
2.20 2.40
N
0.70 1.10
O
0.82 1.22
a1 0.40 0.60
a2 2.10 2.50
y1
-
5o
y2
-
3o
*: Typical, Unit: mm
H02N60I, H02N60J, H02N60E, H02N60F
HSMC Product Specification
Direct download click here
 

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