AD9684 View Datasheet(PDF) - Analog Devices
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AD9684 Datasheet PDF : 64 Pages
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AD9684
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ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
AVDD1 to AGND
AVDD2 to AGND
AVDD3 to AGND
DVDD to DGND
DRVDD to DRGND
SPIVDD to AGND
AGND to DRGND
VIN±x to AGND
SCLK, SDIO, CSB to AGND
VIN±x Maximum Swing
PDWN/STBY to AGND
Environmental
Operating Temperature Range
(TCASE)
Maximum Junction Temperature
Storage Temperature Range
(Ambient)
Rating
1.32 V
2.75 V
3.63 V
1.32 V
1.32 V
3.63 V
−0.3 V to +0.3 V
3.2 V
−0.3 V to SPIVDD + 0.3 V
4.3 V p-p
−0.3 V to SPIVDD + 0.3 V
−40°C to +85°C
125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
Typical θJA, θJB, and θJC are specified vs. the number of printed
circuit board (PCB) layers in different airflow velocities (in
m/sec). Airflow increases heat dissipation effectively reducing
θJA and θJB. The use of appropriate thermal management
techniques is recommended to ensure that the maximum
junction temperature does not exceed the limits shown in Table 7.
Table 7. Simulated Thermal Data
Airflow
PCB
Velocity
Type
(m/sec) θJA
θJB
JEDEC
0.0
2s2p 1.0
Board 2.5
17.81, 2
15.61, 2
15.01, 2
6.31, 3
5.91, 3
5.71, 3
10-Layer 0.0
PCB 1.0
13.8 4.6
12.7 4.6
2.5
12.0 4.6
θJC_TOP
4.71, 5
N/A4
N/A4
4.7
N/A4
N/A4
θJC_BOT
1.21, 5
N/A4
N/A4
1.2
N/A4
N/A4
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1 Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per JEDEC JESD51-8 (still air).
4 N/A means not applicable.
5 Per MIL-STD 883, Method 1012.1.
ESD CAUTION
Rev. 0 | Page 16 of 64
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