UC1617sGAA-2 View Datasheet(PDF) - Unspecified

Part Name

Description

View to exact match

UC1617sGAA-2

128x128 STN Controller-Driver

Unspecified 

ULTRACHIP

©1999~2012

UC1617S_A1.2

128x128 STN Controller-Driver

ORDERING INFORMATION

Part Number

UC1617sGAA

UC1617sGAA-2

MTP

Yes

Yes

I2C

Description

Yes

Gold bumped die

Yes

Gold bumped die, Bump Height 12uM

General Notes

APPLICATION INFORMATION

For improved readability, the specification contains many application data points. When application information is given, it is advisory and does

not form part of the specification for the device.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing. There is no post waffle saw/pack testing

performed on individual die. Although the latest processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers, UltraChip

has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the responsibility of the customer to test

and qualify their applications in which the die is to be used. UltraChip assumes no liability for device functionality or performance of the die or

systems after handling, packing or assembly of the die.

MTP LIGHT SENSITIVITY

The MTP memory cell is sensitive to photon excitation. Under extended exposure to strong ambient light, the MTP cells can lose its content

before the specified memory retention time span. The system designer is advised to provide proper light shields to realize full MTP content

retention performance.

USE OF I2C

The implementation of I2C is already included and tested in all silicon.

LIFE SUPPORT APPLICATIONS

These devices are not designed for use in life support appliances, or systems where malfunction of these products can reasonably be expected to

result in personal injuries. Customer using or selling these products for use in such applications do so at their own risk.

CONTENT DISCLAIMER

UltraChip believes the information contained in this document to be accurate and reliable. However, it is subject to change without notice. No

responsibility is assumed by UltraChip for its use, nor for infringement of patents or other rights of third parties. No part of this publication may be

reproduced, or transmitted in any form or by any means without the prior consent of UltraChip Inc. UltraChip's terms and conditions of sale apply

at all times.

CONTACT INFORMATION

UltraChip Inc. (Headquarter)

4F, No. 618, Recom Road,

Neihu District, Taipei 114,

Taiwan, R. O. C.

Tel: +886 (2) 8797-8947

Fax: +886 (2) 8797-8910

Sales e-mail: sales@ultrachip.com

Web site: http://www.ultrachip.com

4

Share Link: