GRM188R61A106KE69D View Datasheet(PDF) - Unspecified

Part Name

Description

View to exact match

GRM188R61A106KE69D

Chip Monolithic Ceramic Capacitor for General

Unspecified 

! Caution

4-2.Flow Soldering

1. Do not apply flow soldering to chips not listed in Table 2.

　　　　　[Standard Conditions for Flow Soldering]

Table 2

Temperature(℃)

Series

Chip　Dimension(L/W)　Code Temperature Differential

Soldering

Peak

GRM

18/21/31

ΔT≦150℃

Temperature

ΔT

Preheating

Peak

Temperature

Soldering

Gradual

Cooling

2. When sudden heat is applied to the components, the

mechanical strength of the components will decrease

because a sudden temperature change causes

deformation inside the components. In order to prevent

mechanical damage to the components, preheating is

required for both of the components and the PCB.

Preheating conditions are shown in table 2. It is required to

keep the temperature differential between the solder and

the components surface (ΔT) as low as possible.

Preheating

Time

30-90 seconds 5 seconds max.

[Allowable Flow Soldering Temperature and Time]

280

270

3. Excessively long soldering time or high soldering

temperature can result in leaching of the terminations,

260

causing poor adhesion or a reduction in capacitance value

250

due to loss of contact between the inner electrodes and terminations.

240

4. When components are immersed in solvent after mounting,

be sure to maintain the temperature differential (ΔT)

between the component and solvent within the range

shown in the table 2.

Recommended Conditions

Lead Free Solder

230

220

0

10

20

30

40

Soldering Time(s)

In the case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Preheating Peak Temperature

100 to 120℃

Soldering Peak Temperature

250 to 260℃

Atmosphere

Lead Free Solder: Sn-3.0Ag-0.5Cu

Air or N2

5. Optimum Solder Amount for Flow Soldering

5-1. The top of the solder fillet should be lower than the

thickness of the components. If the solder amount is

excessive, the risk of cracking is higher during

board bending or any other stressful condition.

Up to Chip Thickness

Adhesive

in section

JEMCGC-2701X

18

Share Link: