GRM155R70G105KA12D View Datasheet(PDF) - Murata Manufacturing

Part Name

Description

View to exact match

GRM155R70G105KA12D

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

■Soldering and Mounting

1.PCB Design

1. Notice for Pattern Forms

1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted directly on the substrate.

They are also more sensitive to mechanical and thermal stresses than leaded components.

Excess solder fillet height can multiply these stresses and cause chip cracking.

When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility of excess solder fillet height.

1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress on a chip is different depending on PCB material and structure.

When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to the thermal expansion and contraction.

When capacitors are mounted on a fluorine resin printed circuit board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.

Pattern Forms

Placing Close to

Chassis

Prohibited

Chassis

Solder (ground)

Correct

Solder Resist

Placing of Chip

Components

and Leaded

Components

Placing of Leaded

Components after

Chip Component

Lateral Mounting

Electrode Pattern

Lead Wire

in section

Soldering Iron

in section

Lead Wire

in section

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Solder Resist

in section

Solder Resist

in section

Solder Resist

in section

GRM155R70G105KA12-01A

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