LD1117D33C View Datasheet(PDF) - STMicroelectronics
Part Name
Description
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LD1117D33C Datasheet PDF : 44 Pages
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LD1117
Package mechanical data
Note:
Dim.
A
A1
A2
b
b4
c
c2
D
D1
E
E1
e
e1
H
L
L1
L2
L4
R
V2
Table 19. DPAK mechanical data
Type STD-ST
Type Fujitsu-subcon.
Type IDS-subcon
mm.
mm.
mm.
Min.
2.20
0.90
0.03
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
1.00
0.60
0°
Typ.
5.10
4.70
2.28
2.80
0.80
0.20
Max.
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
1.00
8°
Min.
2.25
0.96
0
0.76
5.28
0.46
0.46
6.05
5.27
6.55
2.23
9.90
1.40
1.03
0.70
0°
Typ.
2.30
6.60
4.77
2.28
0.40
Max.
2.35
1.06
0.10
0.86
5.38
0.56
0.56
6.15
5.47
6.65
2.33
10.30
1.60
1.13
0.90
8°
Min.
2.19
0.89
0.03
0.64
5.21
0.46
0.46
5.97
6.35
4.51
9.40
0.90
2.50
0.89
0.64
0°
Typ.
5.20
4.70
2.28
Max.
2.38
1.14
0.23
0.88
5.46
0.58
0.58
6.22
6.73
4.61
10.42
2.65
1.27
1.02
0.20
8°
The DPAK package coming from the two subcontractors (Fujitsu and IDS) are fully
compatible with the ST's package suggested footprint.
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