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TMP03FRU-1995 View Datasheet(PDF) - Analog Devices

Part NameDescriptionManufacturer
TMP03FRU(1995) ADI
Analog Devices ADI
TMP03FRU Datasheet PDF : 0 Pages
TMP03/TMP04
WAFER TEST LIMITS (V+ = +5 V, GND = 0 V, TA = +25؇C, unless otherwise noted)
Parameter
Symbol
Conditions
Min Typ Max
Units
ACCURACY
Temperature Error
Power Supply Rejection Ratio
PSRR
TA = +25°C1
Over Rated Supply
3.0
°C
1.2
°C/V
OUTPUTS
Output High Voltage, TMP04
VOH
Output Low Voltage, TMP04
VOL
Output Low Voltage, TMP03
VOL
IOH = 800 µA
IOL = 800 µA
ISINK = 1.6 mA
V+ – 0.4
V
0.4
V
0.2
V
POWER SUPPLY
Supply Range
Supply Current
V+
4.5
7
V
ISY
Unloaded
1.3
mA
NOTES
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
1Maximum deviation from ratiometric output transfer function over specified temperature range.
ABSOLUTE MAXIMUM RATINGS*
Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . +9 V
Maximum Output Current (TMP03 DOUT) . . . . . . . . . 50 mA
Maximum Output Current (TMP04 DOUT) . . . . . . . . . 10 mA
Maximum Open-Collector Output Voltage (TMP03) . . +18 V
Operating Temperature Range . . . . . . . . . . . –55°C to +150°C
Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . +175°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +160°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300°C
*CAUTION
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation at or above this specification is not implied. Exposure to the above
maximum rating conditions for extended periods may affect device reliability.
2Digital inputs and outputs are protected, however, permanent damage may occur
on unprotected units from high-energy electrostatic fields. Keep units in conduc-
tive foam or packaging at all times until ready to use. Use proper antistatic handling
procedures.
3Remove power before inserting or removing units from their sockets.
Package Type
ΘJA
ΘJC
Units
TO-92 (T9)
1621
120
°C/W
SO-8 (S)
1581
43
°C/W
TSSOP (RU)
2401
43
°C/W
NOTE
1ΘJA is specified for device in socket (worst case conditions).
DICE CHARACTERISTICS
Die Size 0.050 × 0.060 inch, 3,000 sq. mils
( 1.27 × 1.52 mm, 1.93 sq. mm)
For additional DICE ordering information, refer to databook.
Model
TMP03FT9
TMP03FS
TMP03FRU
TMP03GBC
TMP04FT9
TMP04FS
TMP04FRU
TMP04GBC
ORDERING GUIDE
Accuracy
at +25؇C
Temperature
Range
± 3.0
XIND
± 3.0
XIND
± 3.0
XIND
± 3.0
+25°C
± 3.0
XIND
± 3.0
XIND
± 3.0
XIND
± 3.0
+25°C
Package
TO-92
SO-8
TSSOP-8
Die
TO-92
SO-8
TSSOP-8
Die
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the TMP03/TMP04 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–
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