ADP7118ARDZ-2.5 View Datasheet(PDF) - Analog Devices

Part Name

Description

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ADP7118ARDZ-2.5

20 V, 200 mA, Low Noise, CMOS LDO Linear Regulator

Analog Devices 

ADP7118

Data Sheet

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP7118.

However, as listed in Table 6, a point of diminishing returns is

eventually reached, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0805 or 1206 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 64. Example LFCSP PCB Layout

Figure 65. Example SOIC PCB Layout

Rev. C | Page 20 of 23

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