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W25Q32FVSSIP View Datasheet(PDF) - Winbond

Part Name
Description
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W25Q32FVSSIP
Winbond
Winbond Winbond
W25Q32FVSSIP Datasheet PDF : 99 Pages
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W25Q32FV
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Figure 1d. W25Q32FV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB & TC)
3.7 Ball Description TFBGA 8x6-mm
BALL NO.
PIN NAME
I/O
FUNCTION
B2
CLK
I
Serial Clock Input
B3
GND
Ground
B4
VCC
Power Supply
C2
/CS
I
Chip Select Input
C4
/WP (IO2)
I/O
Write Protect Input (Data Input Output 2)(2)
D2
DO (IO1)
I/O
Data Output (Data Input Output 1)(1)
D3
DI (IO0)
I/O
Data Input (Data Input Output 0)(1)
D4
/HOLD or /RESET
I/O
Hold or Reset Input (Data Input Output 3)(2)
(IO3)
Multiple
NC
No Connect
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD (or /RESET) functions are only available for Standard/Dual SPI.
Publication Release Date: Sept 16,, 2013
-8-
Revision H
 

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