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W25Q32FVZEIP View Datasheet(PDF) - Winbond

Part Name
Description
View to exact match
W25Q32FVZEIP
Winbond
Winbond Winbond
W25Q32FVZEIP Datasheet PDF : 99 Pages
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W25Q32FV
8. INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q32FV consists of 45 basic instructions that are
fully controlled through the SPI bus (see Instruction Set Table1-2). Instructions are initiated with the falling
edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code.
Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
The QPI instruction set of the W25Q32FV consists of 32 basic instructions that are fully controlled
through the SPI bus (see Instruction Set Table 3). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all
four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI
instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data
with every two serial clocks (CLK).
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5
through 57. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
8.1 Device ID and Instruction Set Tables
8.1.1 Manufacturer and Device Identification
MANUFACTURER ID
Winbond Serial Flash
(MF7 - MF0)
EFh
Device ID
Instruction
W25Q32FV (SPI Mode)
W25Q32FV (QPI Mode)
(ID7 - ID0)
ABh, 90h, 92h, 94h
15h
15h
(ID15 - ID0)
9Fh
4016h
6016h
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Publication Release Date: Sept 16,, 2013
Revision H
 

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