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D10/CRCW040210010K1ET2 View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
View to exact match
D10/CRCW040210010K1ET2
Vishay
Vishay Semiconductors Vishay
D10/CRCW040210010K1ET2 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
D/CRCW e3
Vishay
Standard Thick Film Chip Resistors
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
4.5
4.7
4.13
4.17.2
4.8.4.2
4.32
4.33
4.19
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
-
-
-
58 (Td)
-
21 (Uu3)
D/CRCW e3
Resistance
-
Voltage proof
Short time overload
U = 1.4 x Uins; 60 s
U = 2.5 x P70 x R
2 x Umax.;
duration: Acc. to style
Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) C
(3 ± 0.3) s
Temperature
coefficient
(20/- 55/20) C and
(20/125/20) C
Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
21 (Uu1) Substrate bending
Depth 2 mm;
3 times
14 (Na)
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
-
Rapid change of
temperature
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
Endurance
at 70 °C
30 min. at - 55 °C;
30 min. at 125 °C
5 cycles
1000 cycles
-
125 °C; 16 h
55 °C; 90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C; 90 % RH;
24 h; 5 cycles
U = P70 x R
U = P70 x R Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
REQUIREMENTS
PERMISSIBLE CHANGE (R)
SIZE 0402 to 2512
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
1 to 10 M
±1%
±5%
No flashover or breakdown
±0.25 % R + 0.05)
±0.5 % R + 0.05)
Good tinning (95 % covered)
no visible damage
Good tinning (95 % covered)
no visible damage
± 100 ppm/K
± 200 ppm/K
No visible damage
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 )
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (0.5 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (4 % R + 0.1 )
www.vishay.com
For technical questions, contact: thickfilmchip@vishay.com
Document Number: 20035
130
Revision: 04-Jun-12
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 

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