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W25Q80DVZPI View Datasheet(PDF) - Winbond

Part NameW25Q80DVZPI Winbond
Winbond Winbond
Description3V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80DVZPI Datasheet PDF : 71 Pages
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W25Q80DV
Read Manufacturer / Device ID Quad I/O (94h)
The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device
ID at 4x speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by
a 24-bit address (A23-A0) of 000000h,but with the capability to input the Address bits four bits per clock.
After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out four bits per clock
on the falling edge of CLK with most significant bit (MSB) first as shown in figure 31. The Device ID
values for the W25Q80DV is listed in Manufacturer and Device Identification table. The Manufacturer
and Device IDs can be read continuously, alternating from one to the other. The instruction is completed
by driving /CS high.
Figure 31. Read Manufacturer / Device ID Quad I/O Diagram
Note:
1. The “Continuous Read Mode” bits M7-0 must be set to FFh to be compatible with Fast Read Quad I/O instruction.
- 47 -
Publication Release Date:July 21, 2015
Prelimry-Revision G
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GENERAL DESCRIPTION
The W25Q80DV (8M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages.
The W25Q80DV array is organized into 4,096 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q80DV has 256 erasable sectors and 16 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.)
The W25Q80DV supports the standard Serial Peripheral Interface (SPI), and a high performance Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 416MHz (104MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. A Hold pin, Write Protect pin and programmable write protection, with top, bottom or complement array control, provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and device identification with a 64-bit Unique Serial Number.

FEATURES
● Family of SpiFlash Memories
   – W25Q80DV: 8M-bit/1M-byte (1,048,576)
   – 256-byte per programmable page
   – Standard SPI: CLK,/CS,DI,DO,/WP,/Hold
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Uniform 4KB Sectors, 32KB & 64KB Blocks
● Highest Performance Serial Flash
   – 104MHz Dual/Quad SPI clocks
   – 208/416MHz equivalent Dual/Quad SPI
   – 50MB/S continuous data transfer rate
● Software and Hardware Write Protection
   – Write-Protect all or portion of memory
   – Enable/Disable protection with /WP pin
   – Top or bottom array protection
● Flexible Architecture with 4KB sectors
   – Uniform Sector/Block Erase (4/32/64-kbytes)
   – Program one to 256 bytes < 0.8ms
   – Erase/Program Suspend & Resume
   – More than 100,000 erase/write cycles
   – More than 20-year data retention
● Low Power, Wide Temperature Range
   – Single 2.7 to 3.6V supply
   – <1µA Power-down(typ.)
● Space Efficient Packaging(1):
   – 8-pin SOIC 150-mil/208mil, VSOP 150-mil
   – 8-pad WSON 6x5-mm, USON 2x3-mm
   – 8-pin PDIP 300-mil
   – 8-ball WLCSP
   – Contact Winbond for KGD and other options

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