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W25Q80DVZPI View Datasheet(PDF) - Winbond

Part NameDescriptionManufacturer
W25Q80DVZPI 3V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI Winbond
Winbond Winbond
W25Q80DVZPI Datasheet PDF : 71 Pages
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W25Q80DV
8. INSTRUCTIONS
The instruction set of the W25Q80DV consists of 34 basic instructions that are fully controlled through
the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip Select
(/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the DI input
is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes,
data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed
with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in
figures 4 through 39. All read instructions can be completed after any clocked bit. However, all
instructions that Write, Program or Erase must complete on a byte boundary (/CS driven high after a full
8-bits have been clocked) otherwise the instruction will be ignored. This feature further protects the
device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when
the Status Register is being written, all instructions except for Read Status Register will be ignored until
the program or erase cycle has completed.
8.1 Manufacturer and Device Identification
MANUFACTURER ID
(MF7-MF0)
Winbond Serial Flash
EFh
Device ID
Instruction
W25Q80DV
(ID7-ID0)
ABh, 90h, 92h, 94h
13h
(ID15-ID0)
9Fh
4014h
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Publication Release Date:July 21, 2015
Prelimry-Revision G
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