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W25Q64FVSFIQ View Datasheet(PDF) - Winbond

Part Name
Description
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W25Q64FVSFIQ Datasheet PDF : 89 Pages
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W25Q64FV
8.10 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q64FV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
PACKAGE TYPE DENSITY
PRODUCT NUMBER
SS
SOIC-8 208mil
ST
VSOP-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP(1)
WSON-8 6x5mm
ZE(1)
WSON-8 8x6mm
TB
TFBGA-24 8x6mm
(5x5 Ball Array)
TC
TFBGA-24 8x6mm
(6x4 Ball Array)
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
W25Q64FVSSIG
W25Q64FVSSIQ
W25Q64FVSSIF
W25Q64FVSTIG
W25Q64FVSTIF
W25Q64FVSFIG
W25Q64FVSFIQ
W25Q64FVSFIF
W25Q64FVDAIG
W25Q64FVDAIQ
W25Q64FVDAIF
W25Q64FVZPIG
W25Q64FVZPIQ
W25Q64FVZPIF
W25Q64FVZEIG
W25Q64FVZEIF
W25Q64FVTBIG
W25Q64FVTBIF
W25Q64FVTCIG
W25Q64FVTCIF
Note:
1.For WSON packages, the package type ZP and ZE is not used in the top side marking.
TOP SIDE MARKING
25Q64FVSIG
25Q64FVSIQ
25Q64FVSIF
25Q64FVTIG
25Q64FVTIF
25Q64FVFIG
25Q64FVFIQ
25Q64FVFIF
25Q64FVAIG
25Q64FVAIQ
25Q64FVAIF
25Q64FVIG
25Q64FVIQ
25Q64FVIF
25Q64FVIG
25Q64FVIF
25Q64FVBIG
25Q64FVBIF
25Q64FVCIG
25Q64FVCIF
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Publication Release Date: October 07, 2013
Revision L
 

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