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25Q64FVBIG View Datasheet(PDF) - Winbond

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25Q64FVBIG Datasheet PDF : 89 Pages
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W25Q64FV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64FV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pin VSOP 208-mil (package
code ST), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil
(package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball (5x5-1 or 6x4 balls) 8x6-mm
TFBGA (package code TB & TC) as shown in Figure 1a-e respectively. Package diagrams and
dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q64FV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q64FV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP / ZE)
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