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25Q64FVAIF View Datasheet(PDF) - Winbond

Part Name25Q64FVAIF Winbond
Winbond Winbond
Description3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
25Q64FVAIF Datasheet PDF : 89 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
W25Q64FV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64FV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pin VSOP 208-mil (package
code ST), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil
(package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball (5x5-1 or 6x4 balls) 8x6-mm
TFBGA (package code TB & TC) as shown in Figure 1a-e respectively. Package diagrams and
dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q64FV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q64FV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP / ZE)
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GENERAL DESCRIPTION
The W25Q64FV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space saving packages.

 

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