25Q64FVAIF View Datasheet(PDF) - Winbond
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25Q64FVAIF Datasheet PDF : 89 Pages
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W25Q64FV
6.2.30 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 29. The Device ID values for the W25Q64FV is listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
CLK
DI
(IO0)
DO
(IO1)
/CS
CLK
Mode 3
Mode 0
0 1 2 3 4 5 6 7 8 9 10
28 29 30 31
Instruction (90h)
Address (000000h)
23 22 21
*
High Impedance
3210
* = MSB
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46
Mode 3
Mode 0
DI
(IO0)
0
DO
(IO1)
Manufacturer ID (EFh)
76543210
*
Device ID
Figure 29. Read Manufacturer / Device ID Instruction (SPI Mode)
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Publication Release Date: October 07, 2013
Revision L
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