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LVB14A
Vishay General Semiconductor
100
10 000
75
50
1000
25
0.2 x 0.2" (5.0 x 5.0 mm)
Copper Pad Areas
0
0 25 50 75 100 125 150 175 200
TJ - Initial Temperature (°C)
Fig. 3 - Pulse Power or Current vs. Initial Junction Temperature
100
TJ = 150 °C
10
TJ = 125 °C
TJ = 25 °C
1
0.1
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Instantaneous Forward Voltage (V)
Fig. 4 - Typical Instantaneous Forward Characteristics
100
0
5
10
15
Reverse Voltage (V)
Fig. 5 - Typical Junction Capacitance
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-214AA (SMB-J-Bend)
Cathode Band
Mounting Pad Layout
0.085 (2.159)
MAX.
0.086 (2.20)
0.077 (1.95)
0.155 (3.94)
0.130 (3.30)
0.086 (2.18)
MIN.
0.096 (2.44)
0.084 (2.13)
0.180 (4.57)
0.160 (4.06)
0.012 (0.305)
0.006 (0.152)
0.060 (1.52)
MIN.
0.220 REF.
0.060 (1.52)
0.030 (0.76)
0.008 (0.2)
0 (0)
0.220 (5.59)
0.205 (5.21)
Revision: 27-Nov-13
3
Document Number: 89420
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