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TDA8140 View Datasheet(PDF) - STMicroelectronics

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TDA8140
ST-Microelectronics
STMicroelectronics ST-Microelectronics
TDA8140 Datasheet PDF : 10 Pages
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TDA8140
The power dissipation on this application condition
is about 1.3W and Figures 10 and 11 show two
ways of heatsinking.
In the first case, a PCB copper area is used as a
heatsink L= 65mm while in the second case, the
device is soldered to an external heatsink ; in both
examples, the thermal resistance junction ambient
is 35°C/W.
Figure 10 : Example of Heatsink using
P.C. Board Copper (L = 65mm)
Copper Area 35µ Thickness
The presence of thermal shut-down circuit does
mean that the heatsink can have a smaller factor
of safety compared with that of a conventional
circuit.
If for any reason, the junction temperature in-
creases up to 150°C, the thermal shut-down simply
switches off the device.
Figure 11 : Example of an External Heatsink
L
9/10
 

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