GMK316BJ010KL-T View Datasheet(PDF) - TAIYO YUDEN
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GMK316BJ010KL-T Datasheet PDF : 48 Pages
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◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
300
Preheating
230℃
60sec. 60sec
Within 10sec.
200 Min. Min.
200
Slow cooling
Peak
260℃ Max.
Within 10sec.
Slow
cooling
100
100
0
Caution
Preheating150℃ Heating above
60sec. Min.
230℃
0
40sec. Max.
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
Preheating
120sec. Min.
200
230～250℃
Within 3sec.
300
120sec. Min.
200
Peak
260℃ Max.
Within 10sec.
Slow cooling
Slow
Preheating cooling
100
100
150℃
Solder
Capacitor
PC board
1/2T～1/3T
T
0
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
400
230～280℃
Within 3sec.
300
200
Slow cooling
100
400
Peak
350℃ Max.
300
Within 3sec.
⊿T
Slow cooling
200
Preheating
100
150℃ Min.
Preheating
0 60sec. Min.
60sec. Min.
0
⊿T
316type or less
⊿T≦150℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
400
300
200
⊿T
100
Peak
280℃ Max.
Within 3sec.
Slow cooling
Preheating
150℃ Min.
60sec. Min.
0
325type or more
⊿T
⊿T≦130℃
5. Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output :
20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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