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BDW83C_07 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
BDW83C_07
ST-Microelectronics
STMicroelectronics ST-Microelectronics
BDW83C_07 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
BDW83C
3
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in
ECOPACKĀ® packages. These packages have a Lead-free second level
interconnect . The category of second level interconnect is marked on the package
and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box
label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com
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