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TMP175AIDGKR View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
TMP175AIDGKR Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout Texas-Instruments
Texas Instruments Texas-Instruments
TMP175AIDGKR Datasheet PDF : 33 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
TMP175, TMP75
SBOS288L – JANUARY 2004 – REVISED DECEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 15
7.5 Programming .......................................................... 16
8 Application and Implementation ........................ 21
8.1 Application Information............................................ 21
8.2 Typical Application ................................................. 21
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Example .................................................... 23
11 Device and Documentation Support ................. 24
11.1 Related Links ........................................................ 24
11.2 Community Resources.......................................... 24
11.3 Trademarks ........................................................... 24
11.4 Electrostatic Discharge Caution ............................ 24
11.5 Glossary ................................................................ 24
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
Changes from Revision K (April 2015) to Revision L
Page
• Changed second Features bullet: added NIST Traceable to TMP75 device ........................................................................ 1
• Added last paragraph to Description section ......................................................................................................................... 1
• Deleted Simplified Schematic figure from page 1 ................................................................................................................. 1
• Changed the Timing Requirements table .............................................................................................................................. 6
• Changed Figure 6 ................................................................................................................................................................ 13
Changes from Revision J (December 2007) to Revision K
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
• Updated parameters in the Timing Requirements table. ....................................................................................................... 6
2
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