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SMP04ES View Datasheet(PDF) - Analog Devices

Part Name
Description
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SMP04ES Datasheet PDF : 15 Pages
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SMP04
VOUT1
VOUT2 VDD VOUT3
VOUT4
VIN1
VIN2
VSS
VIN4
S/H1
VIN3
S/H2 DGND
S/H3 S/H4
Dice Characteristics
Die Size: 0.80 x 0.120 mil = 9,600 sq. mil
(2.032 x 3.048mm = 6.193 sq. mm)
WAFER TEST LIMITS (@ VDD = +12 V, VSS = DGND = 0 V, RL = No Load, TA = +25؇C, unless otherwise noted.)
Parameter
Symbol
Conditions
SMP04G
Limits
Units
Buffer Offset Voltage
Hold Step
Droop Rate
Output Source Current
Output Sink Current
Output Voltage Range
VOS
VHS
V/t
ISOURCE
ISINK
OVR
VIN = +6 V
VIN = +6 V
VIN = +6 V
VIN = +6 V
VIN = +6 V
RL = 20 k
RL = 10 k
± 10
±4
25
1.2
0.5
0.06/10.0
0.06/9.5
mV max
mV max
mV/s max
mA min
mA min
V min/max
V min/max
LOGIC CHARACTERISTICS
Logic Input High Voltage
Logic Input Low Voltage
Logic Input Current
VINH
VINL
IIN
2.4
V min
0.8
V max
1
µA max
SUPPLY CHARACTERISTICS
Power Supply Rejection Ratio
Supply Current
Power Dissipation
PSRR
IDD
PDIS
10.8 V VDD 13.2 V
60
7
84
dB min
mA max
mW max
NOTE
Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed
for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
–4–
REV. D
 

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