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ML145403-6P View Datasheet(PDF) - LANSDALE Semiconductor Inc.

Part NameDescriptionManufacturer
ML145403-6P Drivers/Receivers RS 232/EIA–232–E and CCITT V.28 LANSDALE
LANSDALE Semiconductor Inc. LANSDALE
ML145403-6P Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
LANSDALE Semiconductor, Inc.
ML145403, ML145404, ML145405, ML145408
-A-
20
1
-T-
SEATING
PLANE
E
G
F
OUTLINE DIMENSIONS
P DIP 20 = RP
(ML145403RP, ML145404RP, ML145405RP)
PLASTIC DIP
CASE 738–03
11
B
10
C
K
N
D 20 PL
0.25 (0.010) M T A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
L
FLASH.
M
J 20 PL
0.25 (0.010) M T B M
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.010 1.070 25.66 27.17
B 0.240 0.260 6.10 6.60
C 0.150 0.180 3.81 4.57
D 0.015 0.022 0.39 0.55
E
0.050 BSC
1.27 BSC
F 0.050 0.070 1.27 1.77
G
0.100 BSC
2.54 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.140 2.80 3.55
L
0.300 BSC
7.62 BSC
M
0° 15° 0° 15°
N 0.020 0.040 0.51 1.01
P DIP 24 = LP
(ML145408LP)
PLASTIC DIP
CASE 724–03
–A–
24
13
–B–
1
12
–T–
SEATING
PLANE
E
G
F
L
C
K
N
NOTE 1
M
D 24 PL
0.25 (0.010) M T A M
J 24 PL
0.25 (0.010) M T B M
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 1.230 1.265
B 0.250 0.270
C 0.145 0.175
D 0.015 0.020
E 0.050 BSC
F 0.040 0.060
G 0.100 BSC
J 0.007 0.012
K 0.110 0.140
L 0.300 BSC
M
0
15
N 0.020 0.040
MILLIMETERS
MIN MAX
31.25 32.13
6.35 6.85
3.69 4.44
0.38 0.51
1.27 BSC
1.02 1.52
2.54 BSC
0.18 0.30
2.80 3.55
7.62 BSC
0
15
0.51 1.01
Page 7 of 8
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