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ML145026EP View Datasheet(PDF) - Unspecified

Part Name
Description
View to exact match
ML145026EP
ETC
Unspecified ETC
ML145026EP Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
ML145026, ML145027, ML145028
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
–A–
SO 16W = -5P
SOG (SMALL OUTLINE GULL–WING) PACKAGE
(ML145027-5P, ML145028-5P)
CAS E 751G–02
16
9
–B – 8X P
0.010 (0.25) M B M
1
8
J
16X D
0.010 (0.25) M T A S B S
F
14X G
R X 45
C
–T–
K
S E ATING
PLANE
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MILLIME TE R S INCHE S
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M
0
7
0
7
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. TÒ ypical parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including Typicalsmust be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
Page 19 of 19
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