ML14469QP View Datasheet(PDF) - LANSDALE Semiconductor Inc.
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ML14469QP Datasheet PDF : 10 Pages
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ML14469
–L–
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
PLCC 44 = -4P
(ML14469-4P)
PLCC PACKAGE
CASE 777–02
–N–
Y BRK D
B 0.007(0.180) M T L–M S N S
U 0.007(0.180) M T L–M S N S
Z
–M–
V
44
1
WD
X
VIEW D–D
G1
0.010 (0.25) S T L–M S N S
A
0.007(0.180) M T L–M S N S
R
Z
0.007(0.180) M T L–M S N S
C
E
G
G1
0.010 (0.25) S T L–M S N S
J
0.004 (0.10)
–T– SEATING
PLANE
VIEW S
H
0.007(0.180) M T L–M S N S
K1
K
F
0.007(0.180) M T L–M S N S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
INCHES
DIM MIN MAX
A 0.685 0.695
B 0.685 0.695
C 0.165 0.180
E 0.090 0.110
F 0.013 0.019
G 0.050 BSC
H 0.026 0.032
J 0.020 –––
K 0.025 –––
R 0.650 0.656
U 0.650 0.656
V 0.042 0.048
W 0.042 0.048
X 0.042 0.056
Y ––– 0.020
Z
2
10
G1 0.610 0.630
K1 0.040 –––
MILLIMETERS
MIN MAX
17.40 17.65
17.40 17.65
4.20 4.57
2.29 2.79
0.33 0.48
1.27 BSC
0.66 0.81
0.51 –––
0.64 –––
16.51 16.66
16.51 16.66
1.07 1.21
1.07 1.21
1.07 1.42
––– 0.50
2
10
15.50 16.00
1.02 –––
Page 9 of 10
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